iPhone 16 Series to Feature Advanced 3nm Chip Technology

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Apple launched its iPhone 15 series, which uses the previous iPhone 14’s A15 Bionic chip. The iPhone 15 Pro features the A16 Bionic chip. Rumors are now circulating about the iPhone 16 series, expected to debut next year. We anticipate revolutionary changes in the chipset, including the introduction of a second-generation 3nm chip fabrication process known as N3E. This chip is expected to be found in all four models of the upcoming Apple lineup.

According to MacRumors, “Apple has already placed order commitments with chip supplier TSMC for its second-generation 3nm chip fabrication process, known as N3E.”

According to MacRumors, the foundry house has transitioned N3E to mass production and plans to release an upgraded version, replacing N3 at the start of 2024. TSMC has already secured order commitments from its customers, with Apple being the largest.

Apple is also receiving TSMC’s first-generation 3-nanometer process chips this year. It’s known that Apple booked nearly 90 percent of the foundry’s 3nm production capacity for its devices. Now, Apple is projected to occupy 100 percent of TSMC’s capacity in 2023, due to delays in Intel’s wafer requirements caused by later adjustments to the company’s CPU platform design plans.

Reports suggest that around 4-5 percent of TSMC’s overall sales come from 3nm manufacturing. Apple alone is expected to contribute as much as $3.4 billion in sales for the foundry this year. The iPhone 15 and iPhone 15 Plus feature the A16 Bionic chip, so an upgrade to the A18 chip for the iPhone 16 and iPhone 16 Plus would be noteworthy.

According to Pu’s reports, these chips are expected to be featured in each iPhone 16 model. The iPhone 15 and iPhone 15 Plus are equipped with the A16 Bionic chip, so transitioning to the A18 chip for the iPhone 16 and iPhone 16 Plus would be noteworthy.

  • iPhone 16: A18 chip (N3E)
  • iPhone 16 Plus: A18 chip (N3E)
  • iPhone 16 Pro: A18 Pro chip (N3E)
  • iPhone 16 Pro Max: A18 Pro chip (N3E)

According to the report, TSMC also plans to transition N3P to volume production in the second half of 2024. N3P is purported to provide an enhancement over N3E, offering 5 percent more speed at the same leakage, a 5-10 percent power reduction at the same speed, and a 1.04x increase in chip density.

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